JPH0526759Y2 - - Google Patents

Info

Publication number
JPH0526759Y2
JPH0526759Y2 JP1987082912U JP8291287U JPH0526759Y2 JP H0526759 Y2 JPH0526759 Y2 JP H0526759Y2 JP 1987082912 U JP1987082912 U JP 1987082912U JP 8291287 U JP8291287 U JP 8291287U JP H0526759 Y2 JPH0526759 Y2 JP H0526759Y2
Authority
JP
Japan
Prior art keywords
lead
leads
end portion
semiconductor chip
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987082912U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63191647U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987082912U priority Critical patent/JPH0526759Y2/ja
Publication of JPS63191647U publication Critical patent/JPS63191647U/ja
Application granted granted Critical
Publication of JPH0526759Y2 publication Critical patent/JPH0526759Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1987082912U 1987-05-29 1987-05-29 Expired - Lifetime JPH0526759Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (en]) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (en]) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63191647U JPS63191647U (en]) 1988-12-09
JPH0526759Y2 true JPH0526759Y2 (en]) 1993-07-07

Family

ID=30936002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987082912U Expired - Lifetime JPH0526759Y2 (en]) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0526759Y2 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2782717B2 (ja) * 1988-04-26 1998-08-06 岩崎電気株式会社 発光ダイオード
ES2150409T3 (es) * 1989-05-31 2000-12-01 Osram Opto Semiconductors Gmbh Procedimiento para montar un opto-componente que se puede montar sobre una superficie.
JP3992301B2 (ja) * 1995-04-26 2007-10-17 シチズン電子株式会社 チップ型発光ダイオード
WO2004093204A1 (ja) * 2003-04-16 2004-10-28 Tabuchi Electric Co., Ltd. 反射型発光ダイオード
JP5669866B2 (ja) * 2011-02-09 2015-02-18 三菱電機株式会社 パワー半導体モジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614585U (en]) * 1979-07-16 1981-02-07
US4529902A (en) * 1982-09-01 1985-07-16 Powertron Division Of Contraves Goerz Corp. Frame module for forming tubular frame of permanent magnet direct current motor

Also Published As

Publication number Publication date
JPS63191647U (en]) 1988-12-09

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